Semiconductor manufacturing metrology Semiconductor Metrology in 2026: In-Line Measurement, EUV Critical Dimensions and X-Ray CT Updated: 13 September 2026 Short answer: Semiconductor metrology is becoming harder as device features shrink, structures become more three-dimensional, and advanced packaging hides critical interfaces inside complex assemblies. Fresh 2026 NIST work highlights three important directions: faster in-line metrology for process control, shorter-wavelength EUV methods for critical-dimension measurement, and better X-ray computed-tomography reference artifacts for non-destructive defect detection. These methods do not replace each other. They address different measurement problems across wafer fabrication, process control and advanced packaging. Semiconductor manufacturing depends on measurements that most factory visitors never see. A finished chip may contain structures far smaller than a human hair, repeated acros...